---
title: Shannan O’Shaughnessy of GVD Corporation to Present at SMTA Capital Chapter's Expo and Tech Forum
description: The SMTA Capital Chapter announces that Shannan O’Shaughnessy of GVD Corporation, will present at the upcoming Capital Expo and Tech Forum on August 24th.
image: https://info.zentech.com/hubfs/Capital_Chapter_Logo.jpg
---

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# Shannan O’Shaughnessy of GVD Corporation to Present at SMTA Capital Chapter's Expo and Tech Forum

Posted by [Stephanie Weaver](https://info.zentech.com/blog/author/stephanie-weaver) on Tue, Aug 15, 2017 @ 12:30 PM

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![Capital_Chapter_Logo.jpg](https://info.zentech.com/hs-fs/hubfs/Capital_Chapter_Logo.jpg?width=229&name=Capital_Chapter_Logo.jpg)The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of [GVD Corporation](http://www.gvdcorp.com/?utm_source=hs_email&utm_medium=email&_hsenc=p2ANqtz-_UTm5mUmD3RcMWm3a8W0Pol6kxYzWIZWWRqPVreENQ-0-n8VuR2GXQUk3PcjHlWq6aan5O), will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.  

 

Radio frequency (RF) micro-electronics are used everywhere in today’s technology, from the internet of things to military radar systems. It is challenging for these advanced RF systems to meet size, weight, power and cost requirements set by consumer market or defense agency demand, what the military calls “SWaP-C”, due to the need for packaging of the RF components and integrated circuits (ICs) in to ensure long term reliability. Reliability concerns traditionally necessitate the environmental protection of these high-frequency RF devices at either the component or the assembly level by hermetically sealing the device in a bulky, heavy expensive metal enclosure to prevent degradation caused by hazards in device operating environments. Industry standard conformal coatings are unusable due to the significant signal degradation which occurs if applied directly over an RF circuit. There is a critical need for a coating alternative to which is compatible with high-frequency RF devices to provide a lower weight and lower volume environmental protection scheme with high reliability and negligible performance impact for RF devices. This approach would allow RF device integration on size, weight, and cost effective PCBs and eliminate the hermetically packaged chip-and-wire assemblies currently in use. To address this need, GVD Corporation has developed a high reliability environmental coating, Exilis, for RF electronics devices that can be applied to both the bare device and completed assemblies. 

 

The SMTA Capital Expo and Tech Forum will be held at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723. Registration opens at 8:00 AM and includes a complimentary lunch on the show floor.  Exhibits are open from 9:00 AM until 3:00 PM and the first technical presentation will start at 9:30 AM.

 

[![Click here to register for this free event!](https://no-cache.hubspot.com/cta/default/165279/6cc0044f-7169-461b-89b6-d19b2be2de00.png)](https://cta-redirect.hubspot.com/cta/redirect/165279/6cc0044f-7169-461b-89b6-d19b2be2de00)

 

**About Surface Mount Technology Association (SMTA) **The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit [www.smta.org](file://zestronusa-4/Marketing$/SMTA%20Capital%20Chapter/2016/Press%20Releases/www.smta.org).

 

**About Zentech**: Zentech Manufacturing, Inc. is a privately held, [engineering-driven](https://info.zentech.com/blog/zentechs-engineering-design-services-saves-you-time-and-resources) contract manufacturer specializing in the design and manufacture of highly-complex electronic and RF circuit cards and assemblies. The company is headquartered in its purpose-built facility located in Baltimore, MD and maintains several   
[key certifications](https://info.zentech.com/blog/highly-certified-matters), including ISO 9001:2008, ITAR (US State Dept.), AS9100 (aerospace), and ISO 13485 (medical). In addition, Zentech is a certified IPC Trusted Source supplier for Class 3 mission-critical electronics, and the company is IPC J-STD-001 Space Addendum QML certified. 

 

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