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Package on Package Structures Increase PCB Assembly Complexity

Posted by Laura Austin on Tue, Nov 06, 2012 @ 11:22 PM

The history of circuits and PCB assembly is mostly one of a race to miniaturize circuitry as efficiently as possible to meet consumer demand for ever smaller and more portable devices. Unfortunately, the smaller and more complex the circuitry is, the more complex and fault-intolerant its assembly becomes.

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Topics: pcb assembly, PCB, BGA circuit board, ball grid array, package on package structure, PCB quality control