DfR Solutions Blog posted an interesting article recently regarding the significance of Digital Image Correlation and how this process benefits electronic device manufacturers.
DIC is an optical method used to measure displacements and deformation. Specimens are prepared with a contrasting speckle pattern that can be tracked optically over time as the specimen rigidly moves and deforms.
In contract manufacturing, the status quo is no longer an option. If your product requires high complexity/high-reliability circuit card assemblies, making sure your CM partner is going "above and beyond" to mitigate your risks at the highest levels possible is crucial. There's far too much at stake--such as time, money, market share and, in the case of mil/aero applications, even human lives. At Zentech, that drives us to maintain the highest levels of certification available and to practice strict adherence to industry standards...and then we take it up a notch.
Zentech continues to strive to meet the electronics industry's ever changing technological demands by implementing mid-board copper solutions. A recent article on electronicdesign.com outlines these challenges.