When you consider the RF applications utilized in mission critical C5ISR environments, your contract manufacturer (CM) must comprehend the issues and challenges related to manufacturing processes in RF, but also have a deep understanding of the failure mechanisms that can cause defects.

RF design is inherently more complex than any other type of design. This is because of the unique issues that must be addressed due to the extremely high frequencies of operation for these applications.  For example, there are inherent challenges with power control, grounding structures, printed wiring board (PWB) stack-ups, laminate and surface finish selection, characteristic impedance control, signal path configurations, connectorization, pad geometries, solder mask, conformal coating, surface parasitics, exposure to harsh environments, fabrication effects, via sizing, component selection, and manufacturing process impacts.  These numerous issues must be well understood by your CM or the potential for failure is magnified. 

The following checks and balances ensure that a complex electronics build can be completed on time, on budget and with zero defects. Each practice in this process allows for adjustments or corrections to occur real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.

1. New Product Introduction

To make your product a success, you need to ensure reliability and optimum functionality of the final product. If your company simply takes the data provided and immediately fabricates the product with no careful study of the data, materials or process, it will most likely result in faulty products and leaves you with unhappy customers. Careful review of the data before the manufacturing begins is extremely important.

Effective July 6, 2018 and as mandated by U.S. Trade Representative 301, certain electronic components imported from China will be subject to a 25% tariff.

Looking to excel in your career and grow professionally in a thriving business? Zentech was established in Baltimore, Maryland in 1998,  and has proven to be one of the premier electronics contract manufacturers in the U.S.

Zentech is rapidly growing and seeking to add the following positions:

• Manufacturing Engineers
• Circuit Layout Team Leader with hands-on Mentor Expedition, Allegro or Altium experience preferred.
• QC Inspector
• SMT Operator
  
• SMT Technician

Zentech Manufacturing, Inc., an IPC member company, is pleased to share the following Press Release issued on June 6, 2018 by the IPC:

The U.S. defense industrial base – and the electronics industry in particular – would benefit from a provision in a newly released U.S. Senate bill.

IPC – Association Connecting Electronics Industries welcomes the U.S. Senate’s version of the National Defense Authorization Act (NDAA), which was released to the public this morning.

Zentech provides a wide range of contract manufacturing solutions specializing in high-complexity and high-reliability program requirements, beyond just PCBs.

Our services include:

• Design for Manufacturability
• Prototype and Volume Production
• Risk Management Planning
• New Product Introduction
• Printed Circuit Card Assembly
• Cable Assemblies & Wire Harnesses
• Over-molded Cables
• Lot Control and Traceability 
• Chassis and Box Build
• Test Services
• System Integration
• Field Service Return and Repair

Future Electronics recently released the Q2 2018 Market Conditions Report for the electronics industry.